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| BGA IC Adhesive removing liquid |
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BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones. The ingredients of it is newestly, environmental protection and safest. It has good permeability; it can quickly soften and loosens solidified resin advesive such as phenolics, epoxy, ... |
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| BGA Planting Kit A - B |
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Stainless BGA Planting Kit for Nokia, Siemens, SonyEricsson, Samsung, Motorola
Stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone.
This set can work with 6 different chips. Description of each chip is in manu... |
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| BGA Planting for Siemens x65, x7x |
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Stainless BGA Planting Kit for Siemens series x65, x7x Stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone.
List of supported phones:
- A70, A75, AX75
- C75, CX75, M75
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| Soldering Paste Hakko |
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Hakko Soldering Paste. High quality, acid free soldering paste.
Manufacturer: HAKKO (Japan).
Wrapping: 10g
Quality: Super |
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| BGA Planting Kit |
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BGA Planting Kit. Practical and necessary planting kit for BGA rework. Each proffesional GSM service should have this set. Additionally in this set You may find special holder (for phone board) and practical feeder with solder paste.
This set is necessary to ... |
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| RF 800 SMD/BGA FLUX |
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RF 800 (RF800) SMD/BGA FLUX
Description: - Necessary when repairing damaged BGA balls, soldering BGA chips in mobile phones
- Necessary for SMD repairs
- Featured dropper allow precisely measure flux
- No need cleaning after ...
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| Aoyue 638 - board inspection system |
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Aoyue 638 - board inspection system. Aoyue 638 is a device allowing the inspection of motherboards. With an integrated camera with a lens with variable magnification and a maximum of approximately 100x you can see exactly even the smallest connection betwee... |
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| Solder Flux RMA-223 |
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BGA SOLDER FLUX RMA-223
Description: - Necessary when repairing damaged BGA balls, soldering BGA chips in mobile phones
- Wrapping - squirt 10ml
- Necessary for SMD repairs
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| Soldering Paste CT-61C |
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Soldering Paste CT-61C
The soldering paste is an essential tool during heating process for soldering work.
- Joint hight intensity
- Good immersion
- Neutral PH7 +/- 0.3
- No poison, no corrosion
- Good insulation
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| BGA Solder Balls 0.5 mm |
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BGA Soldering Balls
Size: 0.5 mm
Quantity: 10 000 pieces
Depend on stock You can receive different wrapping type but the product quantity will be the same also quality will be the same. |
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| BGA Solder Balls 0.3 mm |
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BGA Soldering Balls Size: 0.3 mm Quantiety: 10 000 pieces Depend on stock You can receive different wrapping type but the product quantity will be the same also quality will be the same. |
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| Aoyue lead-free Soldering Paste W002 |
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Lead-free soldering paste in 50 grams packaging. |
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| Sita BGA reballing JV-RMS |
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BGA reballing stencils JV-RMS set of 12 pcs. universal BGA rework stencils for repair of most of the IC types, pitch, sizes, ball matrix and patterns.
Technical Specifications:
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| KEDA soldering paste |
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Soldering paste (for BGA hot air reballing etc.)
Wrapping 20g
- Harmful by inhalation and if swallowed
- Danger of cumulative effects
- Keep away from food, drink and animal food
- Don't drink, eat or smoke when using
- Avoid prolonged or repeated con...
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| Desoldering Wick 1,5mm |
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Desoldering Braid (Wick) 1,5mm Copper braids moisten with solder adhesive flux.
Very good thermal conductivity.
Suitable for desoldering overheat sensitive devices and for cleaning PCB's tracks. |
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| Aoyue Soldering Paste W001 |
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Aoyue Soldering Paste W001. Cheaper alternative for best quality "Koki" paste.
Features:
- Solder paste with lead additives
- Capacity 50 grams
- For BGA balls rework
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| Solder paste for SMD KOKI 40g |
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Solder paste for SMD KOKI 40g. High quality surface mount solder paste for manual or automatic dispensing. Blend of metal (Sn-Pb-Ag) powders, RMA flux on resin base, solvent, activators removing the oxides from soldered surfaces and tixotropic additions, that give to the paste... |
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| Active Rosin |
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Active Rosin 35g. Adipic acid (2,5%) activated colophony. No cleaning is needed after soldering because the acid is "bounded" in set colophony.
The colophony exhales nice pine fragrance.
Weight [g] - 35
Wrapping: metal co... |
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| SMD Soldering Paste No Clean 96,5Sn/3Ag |
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SMD Soldering Paste No Clean 96,5Sn/3Ag. Paste designed for soldering SMD components in production processes that dont include washing phase, It`s based on 'no clean' flux type that does not require cleaning and it`s residues dont couse corrosion centres. T... |
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