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Service accesories, Box, Cables
| BGA Planting Kit A - B |
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12.76 USD w/o VAT
If You are EU customer w/o only when You have valid VAT number
15.69 USD Otherwise
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Stainless BGA Planting Kit for Nokia, Siemens, SonyEricsson, Samsung, Motorola
Stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone.
This set can work with 6 different chips. Description of each chip is in manual.
List of supported chips:
- Flash Nokia 6610, 6610i, 7250, 3510, 3510i and similar...
- CPU do SE T230, T610, T630 and similar...
- Dialog do Siemensow serii x65 and similar...
- CPU Siemens C55, C60, MC60 and similar...
- UEM in Nokia phones
- CPU Nokia 7650, SonyEricsson K700, K500, K300 and similar...
- and more (see all chips in manual link)
In set:
- Planting plate
- Description
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Weight 0.01 Kg.
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Product addedd:
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Product-related forum
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Guarantee agreement
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